HEAT EXCHANGER CHEMICAL

A carbo of two pack applied Inorganic based Thixotropic Sealing Compound designed for use where heat transfer is an important requirement. Specifically designed for use on all types of flues e.g. stainless steel, metal sheet,metal to copper,metal to cloth,metal to metal, vitreous enamel, ceramic flue pipes, concrete and pumice block, mould etc. It possesses good cohesion and application properties and will exchange the effects of heat from temperatures of -80 to 150°C.

Typically Used For DEFREEZER, WATER COOLER,MILK COOLER ,BULK COOLER,VISI COOLER ,TABLE TYPE DEFREEZER,COUNTER DEFREEZER, COOLING STONE FOR ICE CREAM MACHINE,COOLING TOWER EXCPT.
Fixing or joining metals to copper,metal to metal,metal to cloth ,good conducter,excellent exchanger of heat, mould(cap in airfilter cooling industries) making,concrete, stone, silicate fibre materials,any casting purpose,potting in anywhere,gap filluping and many other surfaces. Also use to AVOID SOLDERING because of high gripping strenth as well as heat transfer.

Suitable For

  • Thin films/Coating – No
  • Bonding – Yes
  • Encapsulation – No
  • Thick Sections – yes
  • casting,moulding,bonding with metal to metal,copper ,foil paper to metal
Property Value
Major Constituent No
TOXIC YES
FOOD GRADE  TYPE Oxides,isocynate.silcazel,additives
Ready Mixed or 2 part 2 part
Dispensable YES
Relative Viscosity Viscous Paste – Thixotropic
Coverage Rate/Coating Thickness 1 m @ 6 mm diam bead

10m @ 20mm diam bead

Transfer ofTemperature (°C):
Cracking Temperature (°C):
Wet Density (g.cm-3):
Colour:_ off white
SPEIFIC GRAVITY 1.41+/-0.05. (GMS/CC).
– GEL TIME_ 10 MNTS.
– VISCOSITY= 1300/500(CPS).
-80 TO 150°C
250°C
Compressive Strength:
Thermal Conductivity (W.m-1.K-1):
Thermal Expansion (x10-6C-1):
Dielectric Strength (KV.mm-1) @ RT:
Volume Resistivity (Ωcm) @ RT:
650_1000KG/CM SQR.
pH: 13
Expansion on Setting %:
Shrinkage (Linear %): 150-220°C
Shrinkage (Volume %): 150-220°C
0
Hardness Moh’s Scale
Oxidation Resistance Excellent
Alkali Resistance Can be re-dissolved at high pH & temperature
Acid Resistance Excellent – except hydrofluoric
Cure Guide At room temperature
Shelf Life: 12 Months
Packaging: 75KGS

Additional Information
Specifically designed for use on all types of flues e.g. stainless steel,metal to copper,to wood,potting on air ,industrial filter,defreezer cooling tower ,mould making vitreous enamel, ceramic flue pipes, concrete and pumice block etc
• Constituents are inorganic,oxide,silca ,Iso,trilaute,silca zel etc.
• Economical in cost and application
• exchange temperatures -78 to 150°C – Strong adhesive properties at room temperatures once it is cured it will never melt untill temp.reaches more than 150degree
• It is used successfully with Metal to metal,metal to copper ,even also to paper,to cloth,mould making,casting,air filter potting ceramics, glass, metals, concrete, stone, silicate fibre materials and many other surfaces, either to themselves or to each other.
• Good cohesion – and will give good joint and gap-filling properties
• Product will resist the attack of organic solvents, oils, mould, fungi and acids.
• Sets to a hard and rigid ceramic mass which should not deteriorate under thermal shock, or age, under normal conditions. Hardens by air drying and operational heat which improves and strengthens seals and joints.
• RoHS compliant.

Application
IT IS ESSENTIAL THAT ALL SURFACES TO BE BONDED ARE FREE FROM OIL, DUST OR ANY FORM OF SURFACE COATING OR CONTAMINATION.
• For product supplied in plasti carbo- Stir contents of the container prior to use, to overcome the effects of any settlement of the ingredients during storage.
• Ensure that all surfaces to be bonded sealed or insulated, are degreased, clean and free from contamination.
• A light surface abrasion of the material to be bonded will increase the amount of surface area available for adhesion and will give improved mechanical key.
• Apply the adhesive to all surfaces to be bonded.
• To be bonded, ensure that all surface are fully wetted by the adhesive.
• Secure the components and allow the adhesive to set and harden.

Curing
This product is IN ORGANIC BASE based. In order to cure of the material it is necessary to fully dry & dehydrate the adhesive, curing time is according to customer desire,its generally 25 mnts circumstances will allow. The ease by which full curing can be achieved is dependant on the porosity of the substrate, as well as the amount of available surface through which the adhesive film can dry.If quantity will be more than 500 gm curing will be fast,if less quantity surface will absorbe the heat curing will be late.

SPECIAL NOTES
• TAKE A SMALL SAMPLE SET TIMING THEN APPLY.
• CHECK THE APPLIED SURFACE ALWAYS FOR FULLY CURED
• SOMETIMES SOME MOISTURE CONTACT IF IT HAPPENS ADD MOISTURE POWDER OR CONTACT OUR REPRESENTATIVES
• IF MOISTURE CONTACTS AFTER MIXING FOAM WILL COME.
CURING TIME 25 to 30 MNTS,IT CAN BE INCREASE OR DECREASE ACCORDING TO CUSTMER”S WISH.SOLDERING NOT NECESSERY
CAN BE USE BY EMPTY SILICON TUBE USING GUN.

ac)MIXING RATIO BY VOLUME
1KG WHITTE(PEST) TO _150GM BLACK(HARDNER)

MIXING RATIO BY WIGHT

5:1
(BEST TO USE TAKE 200GM PEST ADD 30 GMS HARDNER MIX AND PUT IN AN EMPTY SILICON CARTAGE USING GUN THEN APPLY .)

d)CURING SCHEDULE @ ROOM TEMP._
2
COMPRESIVE STRENGTH 650_1000 KG/CM VISCOCITY _ @ 25 DEGREE CENTIGRADE BY VISCO METER _32000_36000 CPS.
2
LAP STRENGTH 800_100 KG/CM
TEMPERATURE TRANFER FROM -80 DEGREE TO + 150DEGREE

THIS HAS BEEN TESTED IN DEFREEZER COOLING TEST AS WELL AS FURNACE FOR HARDNESS AND REVEALED ABOVE PROPERTIES FOR YOUR INFORMATION.