No Soldering Required
Solder-free, torch-free bonding. Any technician can apply it — no specialist tools or certification needed.
High-performance thermal interface material that bonds copper coolant pipe to defreezer wall in minutes — no torch, no technician, for excellent cooling efficiency.

How it works
A 1–2 mm layer of our inorganic silicon-oxide compound fills every micro-gap between the copper coolant pipe and the defreezer wall — eliminating the air pockets that cripple heat transfer in soldered joints.
Key benefits
Solder-free, torch-free bonding. Any technician can apply it — no specialist tools or certification needed.
Quick-setting thixotropic formula. Dramatically cuts equipment downtime at installation.
Stronger than solder. Lap shear 800–1000 kg/cm². Resists vibration, oils, mould, fungi and acids.
Fills every micro-gap that traps heat. Maximises copper-to-wall contact for optimal heat exchange.
Tested in defreezer cooling and furnace hardness tests. Cracking temperature 250 °C — never melts below 150 °C.
Inorganic base, RoHS compliant. No red rust after 96 hrs ASTM B-117 salt-spray testing.
Where it's used
Send us your bonding or sealing problem — we'll send you a sample tuned to your curing time, temperature range and substrate.
Request a sample