Product · Cooling Exchanger Chemical
Thermal Conductive Paste
An Inorganic Silicon Oxide built for efficient cooling transfer. Mix 5:1, trowel a 1–2 mm layer between copper pipe and surface — gels in ~10 min, cures in 40 min at room temperature, then survives −80 °C to +150 °C without melting.
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Available Pack Sizes
Choose what fits your line
Store in a cool, dry place with the container tightly closed to avoid moisture and water contact. See the Applications page for the four-step application guide.
Our craft
Mixed and QC-checked in Mumbai
Every batch of our inorganic silicon-oxide compound is mixed and quality-checked in our Mumbai facility. We test thermal conductivity, set time, and bond strength on every production run — and we keep records for years, because our customers' service technicians need them.
Our promise
Tuned to your joint
If you can describe your joint — substrate, operating temperature range, target curing time — we will send you a tuned sample. No specialist labour, no torches on site, no surprises.
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