Applications
Six application categories — wherever a copper pipe needs a gap-free thermal bond to a metal wall, or a joint needs to survive extreme temperatures.
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Bond copper coolant pipe directly to the inner wall of any freezer or display cooler — gap-free contact, no soldering.
High-grip bonding for coil-to-shell assemblies that need consistent heat transfer and zero corrosion over years of duty.
Direct paste-to-stone bonding for cooling tawas and stones — better cooling efficiency without solder spots.
Stable from −80 °C to +150 °C — ideal for sensitive vaccine, plasma and dead-body chambers as well as routine lab equipment.
Improve coolant-pipe-to-shell heat transfer in AC, chillers and cooling towers. Seal AC coil chillers without brazing.
High-temperature sealing, gap-filling and crack repair for plants where joints must outlast vibration, thermal shock, oils and acids.
How to Apply
Remove all grease, dust and old adhesive with isopropyl alcohol (thinner). Surfaces must be fully dry before application.
Combine 200 gm Paste + 40 gm ISO (MDI). Mix thoroughly until a smooth, uniform consistency is achieved.
Ensure proper alignment while maintaining maximum contact with the cabinet body. Apply solder spots if required. Spread an even 1–2 mm layer over the copper pipe.
Initial setting time: 40 minutes. Puff can be applied after 40 minutes. Full curing is achieved within 24 hours.
Precaution: store in a cool, dry place with the container tightly closed to avoid moisture and water contact.
We custom-tune curing time, temperature range and substrate compatibility. Send us your bonding or sealing problem.
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